The Indian government has approved four new semiconductor manufacturing projects with Rs46bn ($525mn) in funding under the India Semiconductor Mission (ISM) to boost domestic manufacturing, create jobs and reduce import dependence.
The newly cleared proposals include new facilities for solar energy firm SiCSem and manufacturer 3D Glass Solutions (3DGS) in Bhubaneswar's Info Valley in Odisha, CDIL in Mohali, Punjab, and a new unit for semiconductor producer Advanced System in Package (ASIP) Technologies in Andhra Pradesh in collaboration with South Korea's APACT.
The total number of approved ISM projects is now 10 across six states, with combined investment of about Rs1.60 trillion ($18.25bn).
All four companies are expected to begin production within the next two to three years, Minister for Electronics and Information Technology Ashwini Vaishnaw said.
These projects will help meet India's growing chip demand for telecom, automotive, consumer and industrial electronics, complement its expanding chip-design capabilities and advance the vision of an 'Atmanirbhar Bharat', the government said.
SiCSem, in partnership with UK-based Clas-SiC Wafer Fab, will set up India's first commercial compound-semiconductor fabrication plant in Odisha. It will produce silicon carbide devices for defence systems, electric vehicles (EVs), railways, solar inverters, fast chargers and consumer appliances. The plant will have a total annual capacity of around 60,000 wafers and 96mn packaged units.
3DGS aims to bring advanced semiconductor packaging technology to India. The facility will have various advanced technologies, including glass interposers with passives and silicon bridges and 3D Heterogeneous Integration (3DHI) modules. Its key markets include defence, AI, high-performance computing, automotive, photonics and communications. The unit's planned annual capacity is approximately 69,600 glass panel substrates, 50mn assembled units and 13,200 3DHI modules.
ASIP Technologies, in collaboration with South Korea's APACT, will produce 96mn chip packaging units annually for mobile, automotive and consumer electronics.
CDIL will manufacture over 158mn units/yr of high-power semiconductor devices and transistors for EVs, renewable energy, industrial automation and telecom infrastructure.

